June 25-27, 2012 - Dresden //
organized by Fraunhofer CNT //
Early Bird Registration available until May 7, 2012!
// for more information visit the website: www.wodim2012.com
Patrick Polakowski from Fraunhofer CNT, in collaboration with NaMLab and TU Freiberg, to present results from his Master Thesis “Stabilization of ferroelectric HfO2: The impact of mechanical encapsulation” at EMRS Stassbourg May 17th, 2012 15:00 in Symposium L - Functional Materials and Nanostructures for innovative non-volatile memory devices.
June 17-20, 2012 - Fraunhofer CNT and Partners to present recent progress made in the fields of Atomic Layer Deposition (ALD) and materials integration for Novel ferroelectric for FeFET, improved reliability for 28nm HKMG, Low cost of ownership Large Batch Furnace Replacement Gate Technology, in depth understanding of ZrO2 DRAM Capacitor dielectrics and a superior new ALD Titanium precursor for TiO2.
The 2012 Symposia on VLSI Technology & Circuits, planned for mid-June in Honolulu, points to future directions in memory technology, including 3-D NAND, spin torque transfer MRAM, ferroelectric memories, and other emerging memory types.
Intel’s K. Zhang will give an invited paper on SRAMs using tri-gate transistors, scheduled for June 13th in the late morning.
A team from GlobalFoundries, the Fraunhofer Center of Nanoelectronic Technologies, and NaMLab GmbH will describe progress with ferroelectric materials for non-volatile memories which consume less power than other new memory types.
Fraunhofer CNT and Fraunhofer IZM technology centers of Dresden, Germany, will use CMP supplier Axus Technology exclusively to provide advanced 300mm wafer process development and foundry services to North American customers. Axus Technology is partnering with the Fraunhofer centers for process and metrology services for chemical mechanical polishing (CMP), wafer thinning, and related process technologies, increasing the breadth of offerings in the future. Axus Technology will support local North American customers, define the foundry or development work needed, and work with Fraunhofer engineering teams to complete it.
bubbles & beyond, a technology company focusing on customized intelligent fluids®, and Fraunhofer Center Nanoelectronic Technologies (CNT), Dresden, today announced their collaboration to jointly develop novel cleaning solutions for the microelectronics industry.
Fraunhofer Center Nanoelectronic Technologies (CNT), Dresden and ASELTA Nanographics, Grenoble, today announced the joint development of e-beam proximity effect correction solutions for both mask writing and maskless lithography (ML2) applications. ASELTA Nanographics develops software solutions that reduce manufacturing writing time costs for chips at the 32nm node and beyond while improving pattern fidelity, including cycle time and lithography-image quality.
Fraunhofer CNT today announced the signing of a Joint Development Agreement with ASM International N.V. (ASM). The agreement provides a framework within which a variety of new projects will be executed over the course of the coming five years.
Critical Manufacturing, an enterprise which creates leading edge software solutions for the high-tech manufacturing industries of solar, electronics and semiconductors, announced today that Fraunhofer Center Nanoelectronic Technologies (CNT), selected and implemented cmNavigo Productivity Suite, comprising of a Manufacturing Execution System and Equipment Integration, in its facilities in Dresden, Germany
Fraunhofer Center Nanoelectronic Technologies (CNT) and Tokyo Electron Limited (TEL) announce to intensify its cooperation. The institute acquired an automatic TEL wafer prober in order to meet the requirements of latest measuring tasks related to capacity, quality and positioning accuracy within a large temperature range. Moreover future wafer test and characterization requirements will be developed and verified by means of an additional system. This collaboration is based on a separate evaluation agreement, which was concluded by Fraunhofer CNT and TEL.
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