Competence Areas
Fraunhofer Center Nanoelectronic Technologies
Analytics
The competence group “Analytics” works on the characterization of materials, which are required for the manufacturing of semiconductor circuits. The focus is on the distribution and activity of doping atoms, the characteristics of interfaces and surfaces as well as the characteristics of crystallization and contamination, the improvement of measurement methods or the use of new analysis techniques.
| Microscopy & Topography | Compositional Analysis | Microstructure Analysis | Electrical Characteri zation |
|---|---|---|---|
| Transmission Electron Microscopy (TEM) | Atom Probe Tomography (APT) | X-ray Diffraction (XRD)/ X-ray Reflectrometry (XRR) | Electrical Probing (C-V, I-V) |
| Focused Ion Beam (FIB) | Secondary Ion Mass Spectrometry (SIMS/Tof-SIMS ) | Raman Spectroscopy | Device Characterization & Reliability |
| Scanning Electron Microscopy (SEM/ Review SEM/CD-SEM) | Energy Dispersive X-ray Analysis (EDX)/ Electron Energy Loss Spectroscopy(EELS) | Fourier Transformed Infrared Spectroscopy (FTIR) | 4-Point Resistivity |
| Optical Microscopy | X-ray Photoelectron Spectroscopy | Porosimetry | |
| Atomic Force Microscopy (3D AFM) | Total Reflection X-ray Fluorescence (TXRF) | Spectroscopic Ellipsometry (SE) | |
| Profilometry | SP2 Particle Analysis |
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