AMAT Verity 4i CD-SEM

Applications
• SEM inspection of lithography and etched structures
• Fully automated, high throughput
• 200 and 300 mm wafer capability
• Cu / non-Cu processed wafer

Technical Specifications
• 1.5nm high resolution SEM
• Single electron beam scanning onto the inspection site (Available energy range 200eV~2500eV)
• Low landing energy (200~300eV) for the analysis of sensitive structure (Resist, ultra low-k dielectrics)
• Equipped with in-column detector for the high resolution imaging of the contact holes
• Global or local compensation of the charging of wafer using measurement or compensation box (pre-charged wafer handling)

Advantages/Research Topics
• High precision measurements of varying structures (line, trench, contact hole, profile, roughness, etc.)
• Quantitative evaluation of process results using SEM images and measured results

Inspection Microscope INS 3300 (KLA Tencor)

Applications
• Optical inspection and review
• Tilted view possible (front side and back side)
• Blockwise non-Cu / Cu
• 200mm and 300mm

Technical Specifications
• Optical microscope with CCD camera
• Standard illuminations as well as DUV source with 150x objective for ~200nm resolution
• Inspection, review and automatic defect classification
• Recipe generation for automatic measurements
• Generation of KLA-files for later defect review
• Spot check for automatic comparison with reference image
• Overlay measurement possible

Advantages/Research Topics
• Fast check of optically visible details
• Control of exposures and processes