Tooling and Performance
Fraunhofer-Center Nanoelektronische Technologien
E-Beam Exposure
Variable Shaped Beam Direct Writer SB3050DW (Vistec):
Applications
• Maskless lithography via E-Beam direct writing
• Nano patterning on entire wafer
• Design verification „over night“
• Early device engineering
• Generation of test structures for technology learning & rapid prototyping
Technical Specifications
• Electron Optics: 50keV with 1nm address grid
• Data Processing: High speed 64bit Linux cluster
• PEC correction: Dose & Shape correction for different stacks and processes
• Resolution: 35nm hp dense lines, <25nm for isolated features (using chemically amplified resists)
• Overlay: < 10nm 3s (high accuracy mode)
• CD-Uniformity: <3nm 3s on entire 300mm wafer
• Substrates: wafers of 300mm, 200mm, or less
• Throughput: superior to Gaussian beam writers, write-on-the-fly
Advantages/Research Areas
• Enabling patterning for future technology nodes
• Prototyping and chip personalization




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