• Layout creation / processing of customer layout

(formats: GDSII, OASIS, DXF, CIF)
• Check the success of correction of critical structures with simulation
• Place the pattern in the wafer map

• Fracturing and Proximity Effect Correction:

    • Without any correction the electron scattering and resist

    effects would lead to difference between layout and exposure result →

    proximity effect

    • Proximity effect can be corrected

    • Optional: Proximity parameters are extracted from test exposures

    (not necessary for known stacks and resist processes)

    • Customer pattern is corrected with proximity parameters

DataPrep infrastructure (software/hardware): 
• Klayout
• MGS/PROXECCO
• Aselta Inscale

32bit Linux cluster: 
• Main node (2GB RAM; 4x Intel(R) Xeon(TM) CPU 3.06GHz)
• 16 worker nodes (3GB RAM; 4x Intel(R) Xeon(TM) CPU 3.06GHz) 
• 9.6 TB storage

64bit Linux cluster: 
• Main node [96 GB RAM; 2x Intel(R) Xeon(R) CPU X5650 @ 2.67GHz (6 cores each)]
• 4 worker nodes (48 GB RAM; 2x Intel(R) Xeon(R) CPU L5640 @ 2.27GHz (6 cores each); 2x NVidia M2050 GPU) 
• 18TB storage