Operation Areas
Fraunhofer-Center Nanoelektronische Technologien
Process Integration
Since the flexibility of E-Beam direct writing is most useful for novel integration schemes, the innovations of hard mask or stack materials have to be included into the E-Beam process flow. The CNT patterning group enables the structuring of new materials and hereby supports device learning and investigation of unconventional functional materials.
- Novel hard mask stacks
- Alignment concepts



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