Operation Areas

Fraunhofer-Center Nanoelektronische Technologien

Struktur Patterning

Process Development

In cooperation with resist suppliers and material manufacturers the patterning group evaluates and characterizes new materials. This is not limited to E-Beam structurable resists but also includes the assessment of adhesives, bottom and top coats etc.

  • The evaluation of E-Beam resists may include the following steps:
    - Measurement of the contrast curve
    - Base dose extraction
    - Specification of the resolution limit (dense / isolated structures, LER, cross sections)
    - Process window, linearity
    - Film thickness variation
    - Process variation (PAB, PEB)
    - Delay Stabilities (Vacuum, PCD, PED (air))
    - Extraction of proximity parameters