Operation Areas
Fraunhofer-Center Nanoelektronische Technologien
Process Development
In cooperation with resist suppliers and material manufacturers the patterning group evaluates and characterizes new materials. This is not limited to E-Beam structurable resists but also includes the assessment of adhesives, bottom and top coats etc.
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The evaluation of E-Beam resists may include the following steps:
- Measurement of the contrast curve
- Base dose extraction
- Specification of the resolution limit (dense / isolated structures, LER, cross sections)
- Process window, linearity
- Film thickness variation
- Process variation (PAB, PEB)
- Delay Stabilities (Vacuum, PCD, PED (air))
- Extraction of proximity parameters




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