Microstructure Analysis
Fraunhofer-Center Nanoelektronische Technologien
X-Ray Diffraction (XRD) & X-Ray Reflectometry (XRR)
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- Influence of Si doping in 10nm thin Hf(1-x)SixO2 films on phase formation and crystallization temperature
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- Reciprocal space map around the (224) reflection of an exitaxial grown SiGe film
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- XRR analysis of multilayer stack
Applications
(GI)XRD
• Qualitative and quantitative phase determination, especially of ultra thin films
• Residual stress analysis
• Texture determination
• Determination of grain size
• High temperature XRD for the investigation of crystallization processes and growth kinetics
XRR
• Layer thickness
• Density
• Roughness
Technical Specifications
• Bruker D8 Discover with Cu-Anode (40kV, 40mA)
• 3rd gen. Goebel mirror
• Different parallel plate collimators
• Scintillation counter and PSD (Vantec)
• ¼ circle Eulerian cradle
• mri BTS solid furnace with Be dome for high temperature experiments in chosen atmosphere (vac., N2, He)
• 3rd gen. Goebel mirror
• Different parallel plate collimators
• Scintillation counter and PSD (Vantec)
• ¼ circle Eulerian cradle
• mri BTS solid furnace with Be dome for high temperature experiments in chosen atmosphere (vac., N2, He)
Research Areas
Investigation of ultra thin film of high-k dielectric (down to 2nm):
• Layer thickness, density & roughness
• Phase composition
• Degree of crystallinity
• Thin film phase diagrams
• Layer thickness, density & roughness
• Phase composition
• Degree of crystallinity
• Thin film phase diagrams
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Metallization layers
• Phase compositon
• Texture
• Residual stress
• Layer thickness
PCRAM materials (Ge2Sb2Te5)
• Simultaneous HTXRD/RS measurements
• Simultaneous HTXRD/RS measurements
Epitaxial SiGe films


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