Applications

• Measurement of surface characteristics on blanked- and structured wafer
• Measurement of dishing and erosion after Cu polish
• Different tips possible (radius: 12,5µm – 0,05µm)

Technical Specifications

• Contact profilometer to measure surface profile 
• Automated measurement possible 
• Automated pattern recognition
• Wafer positioning repeatability ±1µm
• The standard repeatability spec is 10A or 0,15%
• Parameter borders 
Scan length: 1µm – 205mm 
Scan speed: 2 – 25000µm/s

Research Areas

• Measurement of dishing and erosion after Cu polish 
• High roughness measurement (controlled by tip size) 
• Cu polish process control
• Profile control for different applications