Applications

• Wafer inspection post processing 
• Tilt-view inspections with separate tilt-review module 
• Cu and non-Cu process capability 
• Automated wafer review

Technical Specifications

• 200mm + 300mm capability 
• CCD camera for image saving 
• 5 different magnification levels (2,5x, 10x, 50x, 100x, 150x) 
• 6th zoom level with DUV source (150x magnification, resolution 200nm) 
• Automated defect binning 
• Creation of KLA files for later defect review 
• Spot check for comparison to reference image 
• Overlay measurement capability