Applications

 

• Measurement of critical dimensions (CD), depth and roughness
• Measurement of roughness on surface (RMS) and sidewalls (LER)
• 200mm and 300mm wafer compatible

 

Technical Specifications

 

• Interaction between tip and surface 
• Direct measurement (no model)
• operations mode: 
- contact mode 
- tapping mode (roughness) 
- DT mode (height profile) 
- CD mode (tip geometry is subtracted)
• 4 cassettes each with 24 tips inside
• Automatic measurement is available
• Automatic tip exchange
• Automated pattern recognition
• The system will be capable of placing a notch oriented wafer on the center of the stage after optics based edge finding within +/-50μm translation and 0.1 degrees theta alignment. Pattern recognition and survey scan edge finding increase the placement accuracy down to the nanometer scale.

 

Research Areas

 

• Tip evaluation and development, calibration standard development
• Measurement of sidewall- and surface roughness in research
• Process monitoring (roughness, CD, height or depth)
• Tool monitoring (for Litho-, Etch- or deposition Tools)